Our vision is to transform how the world uses information to enrich life. Join an inclusive team passionate about one thing : using their expertise in the relentless pursuit of innovation for customers and partners.
The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.
We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Responsibilities include, but not limited to :
Partner with process engineering teams to understand the packaging process and develop analysis models.
Guide test vehicle development to improve simulation correlation to empirical data. Develop test plan wherever necessary to verify the simulation models and validate analysis approach in correlation with test outcomes.
Participates in development of simulation modeling methodologies in flow, thermal and Multiphysics domain
Develop flow and thermal analysis model for the various process involved in semiconductor packaging like Plasma Enhanced Chemical Vapor Deposition (PECVD), Chemical Vapor Deposition (CVD), Cryogenic Cleaning to predicting and enhance the process performance
Provide process & equipment simulation reports to support pathfinding efforts, technology development, and product introduction
Deploys developed simulation methodologies to strengthen Analysis First strategy and develop Digital Twins.
Communicate CFD analysis results to process engineers and provide technical and / or design recommendations.
Responsible for mentoring and maturing analysis capability of Flow and Thermal technology domain
Solid knowledge through coursework and / or experience, in multi-physics modeling and measurements of IC packaging and related areas.
A strong background in physics & chemistry with emphasis on both analytical and measurement methods.
Working knowledge through experience in CFD and high-fidelity Multiphysics simulations.
Detailed knowledge of material properties and material property test methods.
Must be proficient in using either Ansys Fluent and / or Star CCM+
Experience in ACE+ Suite is an added advantage
A good understanding of semiconductor packaging processes, materials and technology trends such as; PECVD, CVD, Cryogenic cleaning;
organic substrate properties, over molding materials and properties, wire-bonding materials and methods, C4 or Cu Pillar attachment methods, etc.
Experience in defining and implementing numerical and / or lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
Ability to work in a team environment and get along with other specialists
Strong oral and written communication skills.
Degree required :
MS or PhD with 6 to 8 years’ experience
Mechanical Engineering, Materials Engineering, Chemical Engineering, Physics, or related discipline