Engineer, Package Simulation
Micron
Hyderabad, TS, IND
6d ago

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing : using their expertise in the relentless pursuit of innovation for customers and partners.

The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.

We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR6214 Engineer, Package Simulation

Responsibilities will include, but are not limited to :

  • Solid knowledge through academic coursework or experience required in thermo-mechanical modeling and measurements of semiconductor packaging and / or PCB assemblies.
  • Through knowledge on Mechanical Shock, Drop, SJR and Thermal Stress concepts.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material properties and material property test methods.
  • Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscoelastic behavior, etc.).
  • Working knowledge in applying Finite Element Modeling (FEM); and familiarity with software tools such as ANSYS (APDL & Workbench).
  • A good understanding of semiconductor packaging processes and materials and technology and trends such as PCB design and manufacturing, molding, wire-bonding, die attach, etc.
  • A good understanding of semiconductor package reliability and defects; solder-joint reliability, warpage, etc.
  • Strong oral and written communication skills.
  • Demonstrated strong work ethic
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