Our vision is to transform how the world uses information to enrich life. Join an inclusive team passionate about one thing : using their expertise in the relentless pursuit of innovation for customers and partners.
The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.
We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Bachelors or advanced degree in Electrical or Mechanical Engineering with significant technical experience
Minimum 2+ years hands on experience with Cadence APD / SIP or equivalent mentor tools is a must
Minimum 2+ years’ experience in packaging area including Wirebond & Flip chip technologies.
Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required
Proficient in AutoCAD 2D and 3D (Inventor a plus)
Ability to travel internationally as required
Create Package Designs
Execute advanced package design reviews in a timely and efficient manner
Design for optimum electrical performance, manufacturability, and package reliability
Perform direct design reviews with assembly subcon design teams
Participate in the DFMEA (Design for Manufacturing) process
Maintain familiarity with documentation work flows and signoff flows
Ensure accurate and timely update of all documents into the Assembly Database
Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
Provide accurate drafting support for the following drawings : Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams